2. Market
  3. Ship Modifications
  4. Subsystems
  5. Caldari Subsystems
  6. Caldari Electronic Subsystems

  7. Tengu Electronics - Dissolution Sequencer

Tengu Electronics - Dissolution Sequencer

This subsystems employs a nano-electromechanical dispersion field to strengthen a vessel's sensor systems. Made from billions of advanced molecular-level circuits, the subsystem offers improved protection against hostile ECM.

Subsystem Skill Bonus:
15% bonus to ship sensor strength, 5% bonus to targeting range per level.

  • fitting
  • 475

    Cpu Output

  • structure
  • 1200000 kg

    Mass

  • 40m³ packaged

    Volume

  • 40

    Structure Hitpoints

  • targeting
  • 75000

    Maximum Targeting Range

  • 20

    Gravimetric Sensor Strength

  • 235

    Scan Resolution

  • miscellaneous
  • 3

    Tech Level

  • 1

    Meta Level

  • 3

    Medium Slot Modifier

  • 1

    Low Slot Modifier

  • 29984

    Restricted To Ship Type

  • blueprint

  • Tengu Electronics - Dissolution Sequencer Blueprint

  • manufacturing
  • base materials
  • 1

    Fullerene Intercalated Sheets

  • 1

    Metallofullerene Plating

  • 7

    Electromechanical Interface Nexus

  • 1

    Neurovisual Output Analyzer

  • 1

    Nanowire Composites

  • 1

    Fulleroferrocene Power Conduits

  • extra materials and skills
  • IV

    Advanced Medium Ship Construction

  • IV

    Electronic Engineering

  • IV

    Caldari Starship Engineering

  • V

    Jury Rigging

  • 1

    Fullerene Intercalated Sheets

  • I

    Electronic Subsystem Technology

  • 1

    Metallofullerene Plating

  • 1

    Electromechanical Interface Nexus

  • 1

    Nanowire Composites

  • 1

    Fulleroferrocene Power Conduits

  • other
  • 1

    Required Skill 1Level

  • 125

    Sub System Slot

  • 0

    Hi Slot Modifier

  • 2

    Light Color

  • 15

    Subsystem Bonus Caldari Electronic

  • 5

    Subsystem Bonus Caldari Electronic 2