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  7. Tengu Electronics - Obfuscation Manifold

Tengu Electronics - Obfuscation Manifold

This subsystem operates using the same fundamental mechanics as the signal distortion amplifier. When installed into a Tech III vessel, the fullerene-based components resonate with any ECM modules fitted, bolstering their disruptive strength.

Subsystem Skill Bonus:
12.5% bonus to ECM target jammer optimal range per level.

  • fitting
  • 460

    Cpu Output

  • structure
  • 1200000 kg

    Mass

  • 40m³ packaged

    Volume

  • 40

    Structure Hitpoints

  • targeting
  • 70000

    Maximum Targeting Range

  • 16

    Gravimetric Sensor Strength

  • 250

    Scan Resolution

  • miscellaneous
  • 3

    Tech Level

  • 1

    Meta Level

  • 4

    Medium Slot Modifier

  • 29984

    Restricted To Ship Type

  • blueprint

  • Tengu Electronics - Obfuscation Manifold Blueprint

  • manufacturing
  • base materials
  • 1

    Fullerene Intercalated Sheets

  • 1

    Metallofullerene Plating

  • 7

    Electromechanical Interface Nexus

  • 1

    Neurovisual Output Analyzer

  • 1

    Nanowire Composites

  • 1

    Fulleroferrocene Power Conduits

  • extra materials and skills
  • IV

    Advanced Medium Ship Construction

  • IV

    Electronic Engineering

  • IV

    Caldari Starship Engineering

  • V

    Jury Rigging

  • 1

    Fullerene Intercalated Sheets

  • I

    Electronic Subsystem Technology

  • 1

    Metallofullerene Plating

  • 1

    Electromechanical Interface Nexus

  • 1

    Nanowire Composites

  • 1

    Fulleroferrocene Power Conduits

  • other
  • 1

    Required Skill 1Level

  • 125

    Sub System Slot

  • 0

    Hi Slot Modifier

  • 0

    Low Slot Modifier

  • 0

    Light Color

  • 12.5

    Subsystem Bonus Caldari Electronic